Ultrasonic Compaction - Incap Corporation

Compact, low-resistance joining for demanding electrical applications.

Ultrasonic compaction is a specialised joining method used to create durable electrical connections with low contact resistance. It is particularly relevant where connection quality, space efficiency, and long-term reliability matter within cable and wire-based assemblies.

At Incap, ultrasonic compaction can be used where conventional methods are less suitable for the product, material combination, or installation requirements. This creates a more space-efficient and robust result within the wider assembly.

Low-heat joining for reliable electrical performance

The process uses ultrasonic energy and controlled pressure to compact strands into a homogeneous metallic bond. Because the heat input remains limited to the joining area, surrounding materials are exposed to less thermal stress during processing.

This can be beneficial in applications where conductivity, stability, and repeatable quality are important, especially in smaller assemblies or where different conductor materials need to be joined.

Built for compact and durable design

Ultrasonic compaction can support smaller terminal designs, reduce the need for additional joining parts, and enable more efficient use of space within the assembly. It can also be used where different materials, such as copper and aluminium, need to be joined in a controlled way.

Depending on the product, this can contribute to lower contact resistance, improved durability, and a more compact overall design.