Contamination-sensitive manufacturing.

Controlled conditions for particle-sensitive assembly, high-precision products and contamination-sensitive final manufacturing steps. Incap’s cleanroom production supports customers who need reliable quality, controlled handling and integrated box-build assembly for advanced electronics and other demanding applications.

Where electronics is handled with special care

Some products cannot be assembled in a standard production environment. When particles can affect product quality, performance or long-term reliability, manufacturing must take place under controlled conditions designed to minimise contamination and support consistent assembly results.

Incap provides cleanroom production for selected products with defined cleanliness requirements. The capability is designed for particle-sensitive assemblies and high-precision applications, especially in semiconductor-related environments and other advanced technology sectors where contamination control is a critical production factor.

When to consider

  • Contamination control for sensitive assemblies – Even very small particles can create significant downstream risks in contamination-sensitive applications.

  • Critical for semiconductor-related applications – Manufacturing processes in semiconductor environments operate at extremely small scales, where contamination can affect yield, reliability and overall product performance.

  • Support for high-precision manufacturing – Cleanroom production helps create the controlled assembly conditions required for demanding end-use environments and supports the product quality expected in advanced technology sectors.

What Incap’s cleanroom production includes

  • Final box-build assembly under controlled conditions – Focus on final assembly operations for products that require controlled environmental conditions, including box-build products with PCBAs, connectors and cables integrated into metal enclosures.
  • Material inspection and cleaning – PCBAs are washed before use in assembly, and materials entering the controlled area are properly inspected and prepared for reliable final integration.
  • Integrated into broader manufacturing flow – Rather than treating the cleanroom as a standalone feature, Incap integrates it into a wider manufacturing process that connects upstream electronics production with controlled final assembly.

Integrated into Incap’s manufacturing flow

Cleanroom production is part of a wider electronics manufacturing process. Depending on the product and customer requirement, this can include sourcing, industrial engineering, PCB assembly, cable and wire harness assembly, box build, quality planning and final assembly under controlled conditions.

This integrated setup is important because customers typically need more than a controlled room. They need a manufacturing partner that can combine contamination-controlled assembly with robust process definition, quality assurance and dependable delivery across the full production chain.

For high-tech applications

Incap’s cleanroom production has been developed to support customer demand for contamination-controlled final assembly, particularly in semiconductor- and microchip-related applications. These requirements are driven by highly sensitive end-use environments in which even minimal particulate contamination can have a measurable impact on functionality, yield and reliability.

The capability is also relevant for other advanced sectors with similar expectations for controlled production conditions. This includes selected microelectronics, medical, aerospace and defence-related applications where the product, process or customer specification calls for controlled handling and assembly.

Production in Slovakia

Incap has expanded its capabilities in Námestovo, Slovakia, with cleanroom production for advanced manufacturing applications requiring controlled assembly conditions. The cleanroom environment supports production under ISO 6–7 conditions and strengthens Incap’s ability to serve customers in semiconductor and other high-tech sectors.

The investment was initiated in response to specific customer requirements for final product assembly in contamination-controlled conditions, further expanding Incap’s role in semiconductor-related and other advanced manufacturing applications.

When to consider

  • Connected manufacturing flow with cable/ PCB assembly, protection of electronics and box build to final product integration

  • Support for microchip production down to 6nm.

  • ISO 6: max 3,520 particles/m³ ≥0.5 µm, semiconductor processes, precision optics, pharmaceutical filling

  • ISO 7: max 352,000 particles/m³ ≥0.5 µm, electronics assembly, medical device assembly, packaging areas

Sectors we serve